• Kuraray Clearfil Se Bond

Kuraray Clearfil Se Bond

  • Starting at :$43.65


  • Product Code:Kuraray Clearfil Se Bond
  • Availability: 2-3 Days



CLEARFIL SE BOND is a simplified, light-cure bonding system containing a water-based primer. The procedure time with CLEARFIL SE BOND is significantly reduced, while providing enhanced bond strength and sealing properties, it can be used with all light-cured restoration. The unique “Outer Case” delivery system allows direct finger control of the contents.

CLEARFIL SE BOND is Kuraray’s high performance,self-etching adhesive for direct restorations – known for its outstanding marginal sealing thanks to the product’s powerful hydrolysis resistance. Dentists and patients appreciate the product’s least postoperative sensitivity. Amongst several universities and opinion leaders CLEARFIL SE BOND is deemed to be the Gold Standard.

Excellent long-term marginal sealing

Dentists who are looking for a bond system that does not only provide a secure handling but also offers a technology ensures a high quality, longterm marginal sealing, will now be satisfi ed by CLEARFIL SE BOND.

  • The unique adhesive MDP monomer takes care of an outstanding stable chemical bonding between adhesive and tooth structure – resistant to
    hydrolysis.
    Due to the mild etching of CLEARFIL SE BOND,the layer of hydroxylapatite widely remains around the collagen fi bers, hence, protected against hydrolysis.
  • The result is different with phosphoric acid etching:Exposed collagen fibers and the bond force betweentooth and adhesive may be destroyed by hydrolysis with the exposure to water or saliva.
  • The marginal sealing is even strengthened by the
    bond’s low water sorption of CLEARFIL SE BOND.
    Hence, the concept performs well: A durable bond is
    created with an exceptionally stable, long-term marginal sealing between restorative material and tooth.
    The risk of secondary caries is minimized.

Least post-operative sensitivities
Apart from the excellent bonding result of CLEARFIL SE BOND, the bond system provides another important function: a precisely concerted composition of primer and bond to ensure minimal post- operative sensitivities. Thanks to the mild etching primer of CLEARFIL SE BOND as well as the reliable bond strength of the bonding, the irritation by moving dentinal fluid is minimized.Furthermore, with the application of the higher viscosity bond subsequent to the primer, the bond creates a strong and stable bond layer. This bond layer has the capability of excellently sealing dentinal tubules,hence, preventing occlusal stress by potential movement of dentinal fluid.
The result is simple: CLEARFIL SE BOND is the precision bonding designed for least postoperative sensitivities.

COMPONENT:

PRIMER

  • 10-Methacryloyloxydecyl dihydrogen phosphate (MDP)
  • 2-Hydroxyethyl methacrylate (HEMA)
  • Hydrophilic aliphatic dimethacrylate
  • dl-Camphorquinone
  • N,N-Diethanol-p-toluidine
  • Water

BOND

  • 10-Methacryloyloxydecyl dihydrogen phosphate (MDP)
  • Bisphenol A diglycidylmethacrylate (Bis-GMA)
  • 2-Hydroxyethyl methacrylate (HEMA)
  • Hydrophobic aliphatic dimethacrylate
  • dl-Camphorquinone
  • N,N-Diethanol-p-toluidine
  • Colloidal silica

INDICATIONS

  • Direct filling restorations using light-cured composite or compomer
  • Cavity sealing as a pre-treatment for indirect restorations
  • Treatment of hypersensitive and/or exposed root surfaces
  • Intraoral repairs of fractured facing crowns made of ceramic, hybrid ceramic or composite resin using light-curing composite
  • Surface treatment of prosthetic appliances made of ceramic, hybrid ceramics and cured composite

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